ДСТУ EN 61709:2018 Компоненты электрические. Надежность. Стандартные условия для оптимизации отказов и погрузочные модели для преобразования (EN 61709:2017, IDT; IEC 61709:2017, IDT)
ДСТУ EN 61709:2018
(EN 61709:2017, IDT; ІЕС 61709:2017, IDT)
Компоненти електричні. Надійність.
Стандартні умови для оптимізації відмов
і навантажувальні моделі для перетворення
Не є офіційним виданням.
Офіційне видання розповсюджує національний орган стандартизації
(ДП «УкрНДНЦ» http://uas.gov.ua)
Contents
Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and symbols
3.1 Terms and definitions
3.2 Symbols
4 Context and conditions
4.1 Failure modes and mechanisms
4.2 Thermal modelling
4.3 Mission profile consideration
4.4 Environmental conditions
4.5 Components choice
4.6 Reliability growth during the deployment phase of new equipment
4.7 How to use this document
5 Generic reference conditions and stress models
5.1 Recommended generic reference conditions
5.2 Generic stress models
6 Integrated semiconductor circuits
6.1 Specific reference conditions
6.2 Specific stress models
7 Discrete semiconductors
7.1 Specific reference conditions
7.2 Specific stress models
8 Optoelectronic components
8.1 Specific reference conditions
8.2 Specific stress models
9 Capacitors
9.1 Specific reference conditions
9.2 Specific stress model
10 Resistors and resistor networks
10.1 Specific reference conditions
10.2 Specific stress models
11 Inductors, transformers and coils
11.1 Reference conditions
11.2 Specific stress model
12 Microwave devices
12.1 Specific reference conditions
12.2 Specific stress models
13 Other passive components
13.1 Specific reference conditions
13.2 Specific stress models
14 Electrical connections
14.1 Specific reference conditions
14.2 Specific stress models
15 Connectors and sockets
15.1 Reference conditions
15.2 Specific stress models
16 Relays
16.1 Reference conditions
16.2 Specific stress models
17 Switches and push-buttons
17.1 Specific reference conditions
17.2 Specific stress model
18 Signal and pilot lamps
18.1 Specific reference conditions
18.2 Specific stress model
19 Printed circuit boards (PCB)
20 Hybrid circuits
Annex A (normative) Failure modes of components
Annex B (informative) Thermal model for semiconductors
Annex C (informative) Failure rate prediction
Annex D (informative) Considerations on mission profile
Annex E (informative) Useful life models
Annex F (informative) Physics of failure
Annex G (informative) Considerations for the design of a data base on failure rates
Annex H (informative) Potential sources of failure rate data and methods of selection
Annex I (informative) Overview of component classification
Annex J (informative) Presentation of component reliability data
Annex K (informative) Examples
Bibliography
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