ДСТУ EN 60749-20-1:2022 Напівпровідникові прилади. Методи механічних і кліматичних випробувань. Частина 20-1. Поводження, пакування, маркування та транспортування приладів для поверхневого монтажу, чутливих д...

ДСТУ EN 60749-20-1:2022
(EN 60749-20-1:2009, IDT; IEC 60749-20-1:2008, IDT)

Напівпровідникові прилади. Методи механічних і кліматичних випробувань. Частина 20-1. Поводження, пакування, маркування та транспортування приладів для поверхневого монтажу, чутливих до спільного впливу вологи та тепла паяння

 
   
 
 
     
Не є офіційним виданням.
Офіційне видання розповсюджує національний орган стандартизації
(ДП «УкрНДНЦ» http://uas.gov.ua)

Contents

FOREWORD

INTRODUCTION

1 Scope

2 Normative references

3 Terms and definitions

4 General applicability and reliability considerations

4.1 Assembly processes

4.1.1 Mass reflow

4.1.2 Localized heating

4.1.3 Socketed components

4.1.4 Point-to-point soldering

4.2 Reliability

5 Dry packing

5.1 Requirements

5.2 Drying of SMDs and carrier materials before being sealed in MBBs

5.2.1 Drying requirements - level A2

5.2.2 Drying requirements - levels B2a to B5a

5.2.3 Drying requirements - carrier materials

5.2.4 Drying requirements - other

5.2.5 Excess time between bake and bag

5.3 Dry pack

5.3.1 Description

5.3.2 Materials

5.3.4 Shelf life

6 Drying

6.1 Drying options

6.2 Post exposure to factory ambient

6.2.1 Floor life clock

6.2.2 Any duration exposure

6.2.3 Short duration exposure

6.3 General considerations for baking

6.3.1 High-temperature carriers

6.3.2 Low-temperature carriers

6.3.3 Paper and plastic container items

6.3.4 Bakeout times

6.3.5 ESD protection

6.3.6 Reuse of carriers

6.3.7 Solderability limitations

7 Use

7.1 Floor life clock start

7.2 Incoming bag inspection

7.2.1 Upon receipt

7.2.2 Component inspection

7.3 Floor life

7.4 Safe storage

7.4.1 Safe storage categories

7.4.2 Dry pack

7.4.3 Dry atmosphere cabinet

7.5 Reflow

7.5.1 Reflow categories

7.5.2 Opened MBB

7.5.3 Reflow temperature extremes

7.5.4 Additional thermal profile parameters

7.5.5 Multiple reflow passes

7.5.6 Maximum reflow passes

7.6 Drying indicators

7.6.1 Drying requirements

7.6.2 Excess humidity in the dry pack

7.6.3 Floor life or ambient temperature/humidity exceeded

7.6.4 Level B6 SMDs

Annex A (normative) Symbol and labels for moisture-sensitive devices

Annex B (informative) Board rework

Annex C (informative) Derating due to factory environmental conditions

Bibliography

Figure 1 - Typical dry pack configuration for moisture-sensitive SMDs in shipping tubes

Figure 2a - Example humidity indicator card for level A2

Figure 2b - Example humidity indicator card for levels B2a to B5a

Figure 2 - Example humidity indicator cards

Figure A.1 - Moisture-sensitive symbol (example)

Figure A.2 - MSID label (example)

Figure A.3 - Information label for level A1 or B1 (example)

Figure A.4 - Moisture-sensitive caution label for level A2 (example)

Figure A.5 - Moisture-sensitive caution label for levels B2-B5a (example)

Figure A.6 - Moisture-sensitive caution label for level B6 (example)

Table 1 - Dry packing requirements

Table 2 - Reference conditions for drying mounted or unmounted SMDs (user bake: floor life begins counting at time = 0 after bake)

Table 3 - Default baking times used prior to dry-pack that were exposed to conditions <60 % RH (supplier bake: MET = 24 h)

Table 4 - Moisture classification level and floor life

Table C.1 - Recommended equivalent total floor life (days) for level A2 at 20 °C, 25 °C, 30 °C and 35 °C for ICs with Novolac, biphenyl and multifunctional epoxies (reflow at same temperature at which component was classified)

Table C.2 - Recommended equivalent total floor life (days) for levels B2a to B5a at 20 °C, 25 °C, 30 °C and 35 °C for ICs with Novolac, biphenyl and multifunctional epoxies (reflow at same temperature at which component was classified)