ДСТУ EN 16602-70-12:2022 Обеспечение космической продукции. Часть 70-12. Правила проектирования печатных плат (EN 16602-70-12:2016, IDT)



ДСТУ EN 16602-70-12:2022
(EN 16602-70-12:2016, IDT)

Забезпечення космічної продукції.
Частина 70-12. Правила проєктування друкованих плат

 
   
 
Не є офіційним виданням.
Офіційне видання розповсюджує національний орган стандартизації
(ДП «УкрНДНЦ» http://uas.gov.ua)

Table of contents

European foreword

Introduction

1 Scope

2 Normative references

3 Terms, definitions and abbreviated terms

3.1 Terms from other standards

3.2 Terms specific to the present standard

3.3 Abbreviated terms

4 Principles

4.1 Qualified PCBs

4.2 Manufacturing tolerances

4.3 Reliability of design

5 Design review and MRR

5.1 Overview

5.2 Documentation

6 General design and production requirements

6.1 Reliability of design

6.2 Choice of materials and build-up

6.3 Selection of the PCB manufacturer

6.4 Traceability and marking

7 Rigid PCBs

7.1 PCB build-up

7.2 PCB dimension

7.3 Thickness of PCB

7.4 Track width and spacing

7.5 Pad design

7.6 Copper planes in rigid PCB

7.7 Design considerations for the prevention of sliver and peelable

7.8 PCB surface finish

8 Flex PCBs

8.1 Overview

8.2 Dynamic applications

8.3 PCB build-up

8.4 Track design

8.5 Through holes

8.6 Bending radius

8.7 Sculptured flex PCB

9 Rigid-flex PCBs

9.1 Overview

9.2 General

9.3 Build-up

9.4 Cover layer

9.5 Interface of rigid part and flexible part

9.6 Pads

10 Thermal rules and heat sinks

10.1 Overview

10.2 General requirements

10.3 Specific requirements for external heat sink

10.4 Specific requirements for internal heat sink

11 HDI PCBs

11.1 Overview

11.2 Justification

11.3 Microvia technology

11.4 Microvias

11.5 Core PCB for HDI

12 PCBs for high frequency applications

12.1 Material selection

12.2 Build-up of RF PCB

12.3 Embedded film resistors

12.4 Thickness of RF PCB

12.5 Track width and spacing

12.6 Pad design

12.7 Surface finish

12.8 Profiled layers and vias

13 Electrical requirements for PCB design

13.1 Overview

13.2 General

13.3 PCB drying

13.4 Electrical characteristics

13.5 Floating metal

13.6 Current rating

13.7 Provisions to prevent open circuit failure on critical tracks

13.8 Voltage rating

13.9 Double insulation design rules for critical tracks

13.10 lnsulation distance of combined requirements on rigid PC

13.11 Controlled impedance tracks

13.12 Digital PCB

13.13 Analog PCB

13.14 Mixed analog-digital PCB

14 Design for assembly

14.1 Overview

14.2 General

14.3 Placement requirements

14.4 Specific requirements for fused tin-lead finish

14.5 Dimensional requirements for SMT foot print

15 Design of test coupon

15.1 Design rules for test coupon

15.2 Test coupon design

Annex A (normative) PCB definition dossier - DRD

Annex В (normative) PCB manufacturing dossier - DRD

Annex C (informative) Example of capability list of PID

Annex D (informative) Track current rating computation methodology

Annex E (informative) Example of calculation of PTH pad dimensions

Annex F (informative) Prevention of resin starvation and cracks

Annex G (informative) Example of MRR checklist

Bibliography