ДСТУ 62258-2:2022 Полупроводниковые кристаллы. Часть 2. Обмен форматами данных (EN 62258-2:2011, IDT; IEC 62258-2:2011, IDT)



ДСТУ EN 62258-2:2022
(EN 62258-2:2011, IDT; IEC 62258-2:2011, IDT)

Напівпровідникові кристали.
Частина 2. Обмін форматами даних

 
 
 
 
     
Не є офіційним виданням.
Офіційне видання розповсюджує національний орган стандартизації
(ДП «УкрНДНЦ» http://uas.gov.ua)

Contents

INTRODUCTION

1 Scope and object

2 Normative references

3 Terms and definitions

4 Requirements

5 Device Data eXchange format (DDX) file goals and usage

6 DDX file format and file format rules

6.1 Data validity

6.2 Character set

6.3 SYNTAX RULES

7 DDX file content

7.1 DDX file content rules

7.2 DDX DEVICE block syntax

7.3 DDX data syntax

8 Definitions of DEVICE block parameters

8.1 BLOCK DATA

8.2 DEVICE DATA

8.3 GEOMETRIC DATA

8.4 TERMINAL DATA

8.5 MATERIAL DATA

8.6 ELECTRICAL AND THERMAL RATING DATA

8.7 SIMULATION DATA

8.8 HANDLING, PACKING, STORAGE and ASSEMBLY DATA

8.9 WAFER SPECIFIC DATA

8.10 BUMP TERMINATION SPECIFIC DATA

8.11 MINIMALLY PACKAGED DEVICE (MPD) SPECIFIC DATA

8.12 QUALITY, RELIABILITY and TEST DATA

8.13 OTHER DATA

8.14 CONTROL DATA

Annex A (informative) An example of a DDX DEVICE block

Annex B (informative) Groups and Permutation

Annex C (informative) A Typical CAD view from the DDX file block example given in Annex A

Annex D (informative) Properties for Simulation

Annex E (informative) TERMINAL and TERMINAL_TYPE graphical usage for CAD/CAM systems

Annex F (informative) Cross-reference with IEC 61360-4

Annex G (informative) Notes on VERSION and NAME parameters

Annex H (informative) Notes on WAFER parameters

Annex I (informative) Additional notes

Annex J (informative) DDX Version history

Annex K (informative) Parse Control