ДСТУ EN 62326-20:2022 Печатные платы. Часть 20. Печатные платы для светодиодов высокой яркости (EN 62326-20:2016, IDT; IEC 62326-20:2016, IDT)



ДСТУ EN 62326-209:2022
(EN 62326-20:2016, IDT; IEC 62326-20:2016, IDT)

Друковані плати. Частина 20. Друковані плати для світлодіодів високої яскравості

 
   
 
Не є офіційним виданням.
Офіційне видання розповсюджує національний орган стандартизації
(ДП «УкрНДНЦ» http://uas.gov.ua)

CONTENTS

FOREWORD

1 Scope

2 Normative references

3 Terms, definitions and abbreviations

3.1 Terms and definitions

3.2 Abbreviations

4 Classification and class of the printed circuit board for high-brightness LEDs

5 Design rules and allowance

5.1 Panel and board sizes

5.2 Total board thickness

5.3 Holes

5.4 Conductor

5.5 Printed contact

5.6 Land pattern

5.7 Fiducial mark and mark for component positioning

5.8 Interlayer connection – Copper plating

6 Quality

6.1 Gap between conductor and the wall of a component insertion hole or a via

6.2 Positional deviation between conductor layers of a multilayer board

6.3 Minimum land width

6.4 Surface treatment

6.5 Defects of solder resist

6.6 Symbol mark

6.7 Land

6.8 Land of a land pattern

6.9 Defects in a land for BGA/CSP mounting

6.10 Printed contact

7 Performance and test methods

7.1 Resistance of conductors

7.2 Current proof of conductor and plated through hole

7.3 Observation of component mountings and vias

8 Marking, packaging and storage

8.1 Marking on a product

8.2 Marking on the package

8.3 Packaging and storage

Annex A (informative) Classification and class of the PCB for high-brightness LEDs

Bibliography