ДСТУ EN IEC 61191-1:2022 Сборка печатных плат. Часть 1. Общая спецификация. Требования к паяным электрическим и электронным сборкам с использованием поверхностного монтажа и соответствующих технологий сборки...

ДСТУ EN IEC 61191-1:2022
(EN IEC 61191-1:2018, IDT; IEC 61191-1:2018, IDT)

Складання друкованих плат. Частина 1. Загальні технічні умови.
Вимоги до паяних електричних та електронних вузлів з використанням
поверхневого монтажу та пов’язаних з ним технологій складання

 
     
Не є офіційним виданням.
Офіційне видання розповсюджує національний орган стандартизації
(ДП «УкрНДНЦ» http://uas.gov.ua)

Contents

Foreword

1 Scope

2 Normative references

3 Terms and definitions

4 General requirements

4.1 Order of precedence

4.1.1 General remark

4.1.2 Conflict

4.1.3 Conformance documentation

4.2 Interpretation of requirements

4.3 Classification

4.4 Defects and process indicators

4.5 Process control requirements

4.6 Requirements flowdown

4.7 Physical designs

4.7.1 New designs

4.7.2 Existing designs

4.8 Visual aids

4.9 Proficiency of personnel

4.9.1 Design proficiency

4.9.2 Manufacturing proficiency

4.10 Electrostatic discharge (ESD)

4.11 Facilities

4.11.1 General

4.11.2 Environmental controls

4.11.3 Temperature and humidity

4.11.4 Lighting

4.11.5 Field conditions

4.11.6 Clean rooms

4.12 Assembly tools and equipment

4.12.1 General

4.12.2 Process control

5 Requirements of materials

5.1 Overview

5.2 Solder

5.3 Flux

5.4 Solder paste

5.5 Preform solder

5.6 Adhesives

5.7 Cleaning agents

5.7.1 General

5.7.2 Cleaning agents selection

5.8 Polymeric coatings

5.8.1 Solder resists and localized maskants

5.8.2 Conformal coating and encapsulants

5.8.3 Spacers (permanent and temporary)

5.9 Chemical strippers

5.10 Cleaning Agents

5.11 Heat shrinkable soldering devices

6 Components and printed board requirements

6.1 General

6.2 Solderability

6.2.1 Parts solderability

6.2.2 Reconditioning

6.2.3 Solderability testing of ceramic boards

6.3 Solderability maintenance

6.3.1 General

6.3.2 Preconditioning

6.3.3 Gold embrittlement of solder joints

6.3.4 Tinning of non-solderable parts

6.4 Solder purity maintenance

6.5 Lead preparation

6.5.1 General

6.5.2 Lead forming

6.5.3 Lead-forming limits

7 Assembly process requirements

7.1 Overview

7.2 Cleanliness

7.3 Part markings and reference designations

7.4 Solder connection contours

7.5 Moisture traps

7.6 Thermal dissipation

8 Assembly soldering requirements

8.1 General

8.1.1 Soldering process

8.1.2 Machine maintenance

8.1.3 Handling of parts

8.1.4 Preheating

8.1.5 Carriers

8.1.6 Hold down of surface mount leads

8.1.7 Heat application

8.1.8 Cooling

8.2 Reflow soldering

8.2.1 Requirements

8.2.2 Process development for reflow soldering

8.2.3 Flux application

8.2.4 Solder application

8.3 Manual/hand soldering

8.3.1 Non-reflow manual soldering

8.3.2 Reflow manual soldering

9 Cleanliness and residue requirements

9.1 General

9.2 Qualified cleaning/manufacturing process

9.2.1 General

9.2.2 Cleaning designator

9.2.3 Upper specification limit

9.3 Visual requirements

9.4 Correlation of ionic testers

9.5 Non-ionic residues

9.6 SIR testing

10 Assembly requirements

10.1 General

10.2 Acceptance requirements

10.2.1 Process control

10.2.2 Corrective action limits

10.2.3 Control limit determination

10.3 General assembly requirements

10.3.1 Assembly integrity

10.3.2 Assembly damage

10.3.3 Markings

10.3.4 Flatness (bow and twist)

10.3.5 Solder connection

10.3.6 Interfacial connections

11 Coating and encapsulation

11.1 Conformal coating

11.1.1 Coating instructions

11.1.2 Application

11.1.3 Performance requirements

11.1.4 Rework of conformal coating

11.1.5 Conformal coating inspection

11.2 Encapsulation

11.2.1 Encapsulation instructions

11.2.2 Application

11.2.3 Performance requirements

11.2.4 Rework of encapsulant material

11.2.5 Encapsulant inspection

12 Rework and repair

12.1 Rework of unsatisfactorily soldered electrical and electronic assemblies

12.2 Repair

12.3 Post rework/repair cleaning

13 Product quality assurance

13.1 System requirements

13.2 Inspection methodology

13.2.1 Verification inspection

13.2.2 Visual inspection

13.2.3 Sampling inspection

13.3 Process control

13.3.1 System details

13.3.2 Defect reduction

13.3.3 Variance reduction

14 Other requirements

14.1 Health and safety

14.2 Special manufacturing requirements

14.2.1 Manufacture of devices incorporating magnetic windings

14.2.2 High-frequency applications

14.2.3 High-voltage or high-power applications

14.3 Guidance on requirement flowdown

15 Ordering data

Annex A (normative) Requirements for soldering tools and equipment

A.1 Requirements for tools and equipment

A.2 Abrasives

A.3 Benchtop and hand-soldering systems

A.4 Soldering iron holders

A.5 Wiping pads

A.6 Soldering guns

A.7 Solder pots

A.8 Process control

Annex B (normative) Quality assessment

B.1 Process control (PC)

B.2 Reduction of quality conformance testing

B.3 Audit plan

Bibliography