ДСТУ IEC 60748-2:2015 Приборы полупроводниковые. Интегральные схемы. Часть 2. Цифровые интегральные схемы (IEC 60748-2:1997, IDT)

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IEC 60748-2:1997

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits

прийнято як національний стандарт
методом «підтвердження» за позначенням

ДСТУ IEC 60748-2:2015
(IEC 60748-2:1997, IDT)

Прилади напівпровідникові. Інтегральні схеми. Частина 2. Цифрові інтегральні схеми

З наданням чинності від 2016–01–01

 

З питань придбання офіційного видання звертайтесь
до національного органу стандартизації
Не є офіційним виданням.
Офіційне видання розповсюджує національний орган стандартизації
(ДП «УкрНДНЦ» http://uas.gov.ua)

CONTENTS

FOREWORD

CHAPTER I: GENERAL

1 Scope

2 Normative references

CHAPTER II: TERMINOLOGY AND LETTER SYMBOLS

1 Terminology for combinatorial and sequential integrated circuits

1.1 General terms

1.2 Terms related to functions

1.3 Types of circuits

1.4 Terms related to ratings and characteristics

1.5 Latch-up concept

2 Examples

3 Terminology for integrated circuit memories

3.1 General terms

3.2 General terms relating to memory function and organization

3.3 Types of memories

3.4 Terms related to ratings and characteristics

3.5 Typical waveforms for static read/write memories

3.6 Terms and descriptions for test patterns for memory testing

4 Terminology for integrated circuit microprocessors

5 Terminology for charge-transfer devices

6 Letter symbols for combinatorial and sequential circuits

7 Letter symbols for the dynamic parameters of sequential integrated circuits, including memories

8 Additional terms and definitions for digital integrated circuits

9 Classification of programmable logic devices (PLDs) 

CHAPTER III: ESSENTIAL RATINGS AND CHARACTERISTICS

SECTION ONE — DIGITAL INTEGRATED CIRCUITS, GENERAL

1 Circuit identification and description

1.1 Designation and type

1.2 Technology

1.3 Package identification

2 Functional specifications

2.1 Block diagram

2.2 Functional description

2.3 Complex structures

 3 Ratings (limiting values)

3.1 Continuous voltages and currents

3.2 Non-continuous voltages and currents

3.3 Temperatures

3.4 Capability of sustaining a short circuit

4 Recommended operating conditions (within the specified operating temperature range)

5 Static electrical characteristics for bipolar integrated circuits

5.1 Essential characteristics of the digital voltage signals

5.2 Input clamping voltage (where appropriate)

5.3 Essential characteristics for input and output currents

5.4 Applied conditions for worst case

5.5 Latch-up characteristics

6 Static and quasi-static electrical characteristics for MOS integrated circuits

6.1 Essential characteristics of the digital voltage signals

6.2 Essential characteristics for currents

6.3 Latch-up characteristics

7 Dynamic electrical characteristics

7.1 Introduction

7.2 Times characterizing the response of the circuit

7.3 Requirements at the inputs to ensure correct sequential operation

7.4 Input and output impedances

8 Total power or currents provided from the supplies

9 Total current drawn from the power supplies (dynamic operation)

10 Command pulse information (where appropriate)

11 Insulation resistance

12 Mechanical ratings, characteristics and other data

13 Supplementary information

13.1 Output loading capability

13.2 Noise margins

13.3 Interconnections of digital integrated circuits

14 Handling precautions

APPENDIX TO SECTION ONE — Specification of characteristics

SECTION TWO — INTEGRATED CIRCUIT MEMORIES

A. Static and dynamic read/write memories and read-only memories

1 Circuit identification and description

2 Functional specifications

2.1 Block diagram

2.2 Functional description

3 Ratings (limiting values)

4 Recommended operating conditions (within the specified operating temperature range)

5 Static electrical characteristics for bipolar memories

6 Static electrical characteristics for MOS memories

7 Dynamic electrical characteristics

7.1 Times characterizing the response of the circuit

7.2 Requirements at the inputs to ensure correct sequential operation

7.3 Input and output capacitances

8 Power or current drawn from each supply (static operation)

9 Power or current drawn from each supply (dynamic operation)

10 Mechanical ratings, characteristics and other data

11 Supplementary information

11.1 Output loading capability

11.2 Noise margins

11.3 Interconnections of similar units

11.4 Type of output circuit

11.5 Interconnections to other types of circuits

12 Handling precautions

B. Field-programmable read-only memories

1 Circuit identification and description

2 Functional specifications

2.1 Block diagram

2.2 Identification of terminals

2.3 Functional description

3 Ratings (limiting values)

4 Read mode

4.1 Recommended operating conditions (within the specified operating temperature range)

4.2 Static electrical characteristics

4.3 Dynamic electrical characteristics

4.4 Timing requirements

5 Programming mode

5.1 Programming procedure

5.2 Recommended programming conditions

5.3 Timing requirements

6 Erasing mode (if applicable)

6.1 Electrically erasable memories

6.2 Ultraviolet erasable memories

7 Number of programming-erasing cycles

8 Data retention information

9 Power or current drawn from each supply (static operation)

10 Power or current drawn from each supply (dynamic operation)

11 Mechanical ratings, characteristics and other data

12 Supplementary information

12.1 Output loading capability

12.2 Electrical noise margins

12.3 Interconnections of similar units

12.4 Type of output circuit

12.5 Interconnections to other types of circuits

13 Handling precautions

C. Content addressable memories (CAM)

1 Circuit identification and description

2 Functional specifications

2.1 Block diagram

2.2 Functional description

2.3 Instruction set

2.4 Operation mode

3 The provisions of clauses 3 to 6 of Section Two A apply

4 The provisions of clauses 7 and 7.1 of Section Two A apply with the exception of 7.1.1 which is replaced by the following

5 The provisions of 7.2 and 7.3 of Section Two A apply

6 The provisions of clauses 8 to 12 of Section Two A apply

SECTION THREE — INTEGRATED CIRCUIT MICROPROCESSORS

1 Circuit identification and description

1.4 Electrical compatibility

2 Functional specifications

2.1 Block diagram

2.2 Functional description

2.3 Instruction set

2.4 Configuration of instructions

2.5 Input and output signals

3 Ratings (limiting values)

3.1 Electrical limiting values

3.2 Temperatures

3.3 Power dissipation

4 Recommended operating conditions (within the specified operating temperature range)

4.1 Power supply voltage(s)

4.2 Clock inputs

4.3 Input voltages (excluding clock inputs)

4.4 Output currents

4.5 External elements (where appropriate)

4.6 Set-up and hold times

4.7 Timing diagrams for control sequences

5 Electrical characteristics

5.1 Static characteristics

5.2 Dynamic characteristics

6 Mechanical ratings, characteristics and other data

7 Supplementary information

7.1 Output loading capability

7.2 Noise margins

7.3 Application data

7.4 Other information

8 Handling precautions

SECTION FOUR — PROGRAMMABLE LOGIC DEVICES (PLDs)

1 Circuit identification and types

1.1 Designation of types

1.2 General function description

1.3 Manufacturing technology

1.4 Package identification

2 Application related description

2.1 Main application and features

2.2 Overall block diagram

2.3 Main features available by programming

2.4 Reference data

2.5 Electrical compatibility

2.6 Associated devices

3 Specification of the function

3.1 Detailed block diagram - functional blocks

3.2 Identification and function of terminals

3.3 Functional description

3.4 Family related characteristics

4 Limiting values (absolute maximum rating system)

4.1 Electrical limiting values

4.2 Temperatures

5 Recommended operating conditions (within the specified operating temperature range)

5.1 Power supplies – positive and/or negative values

5.2 Initialization sequences

5.3 Clock input(s) (where appropriate)

5.4 Input voltage(s)

5.5 Output current(s)

5.6 Voltage and/or current of other terminal(s)

5.7 External elements (where appropriate)

5.8 Operating temperature range

5.9 Timing requirements

6 Electrical characteristics

6.1 Static characteristics

6.2 Dynamic characteristics

6.3 Timing diagram

6.4 Capacitances

7 Programming

7.1 Programming mode

7.2 Erasing mode (if applicable)

7.3 Number of programming-erasing cycles (where appropriate)

7.4 Data retention information

8 Design aspects

8.1 Computer aided engineering (CAE) design hardware

8.2 CAE design software

9 Mechanical and environment rating, characteristics and data

10 Additional information

10.1 Equivalent input and output circuit

10.2 Internal protection

10.3 Thermal resistance

10.4 Noise margin

10.5 Output loading capability

10.6 Interconnections of digital circuits

10.7 Interconnections to other types of circuit

10.8 Effects of externally connected component(s)

10.9 Recommendations for any associated device(s)

10.10 Handling precautions

10.11 Application data

10.12 Other application information

10.13 Date of issue of data sheet

CHAPTER IV: MEASURING METHODS

SECTION ONE — GENERAL

1 Basic requirements

2 Specific requirements

2.1 General requirements for static and dynamic measurements

2.2 Specified conditions for static characteristics

2.3 Specified conditions for dynamic characteristics

3 Application matrix for the measuring methods

SECTION TWO — MEASURING METHODS OF STATIC CHARACTERISTICS

1 High-level and low-level output voltages (V_OH and V_OL)

2 High-level and low-level input currents (I_IH and I_IL)

3 Short-circuit output current (I_OS)

4 Power supply current under static conditions

5 (Input) threshold voltages and hysteresis voltage

6 Input clamping voltage (V_IK)

7 Off-state output current (I_OZ)

8 Latch-up characteristics

8.1 Positive latch-up input or output voltage or current

8.2 Negative latch-up input or output voltage or current

8.3 Latch-up supply voltage or current

8.4 Latch-up state (supply) voltage or current

8.5 Precautions

8.6 Post-test measurement

SECTION THREE — DYNAMIC MEASUREMENTS

1 Total current drawn from the power supplies under dynamic conditions

2 Power supplied through the clock line

3 Input and output impedances

3.1 Current measurement: input and output capacitances for large-signal operation

3.2 Voltage measurement: equivalent input and output capacitances, equivalent input and output resistances

4 Times characterizing the circuit

4.1 Propagation times

4.2 Delay and transition times

4.3 Set-up time 8 and hold time

4.4 Resolution time 36

4.5 Output enable and disable times (for three-state outputs)

4.6 Specific times for memories

5 Switching frequency of a sequential circuit

6 Method of verification of the function of a digital integrated circuit

CHAPTER V: ACCEPTANCE AND RELIABILITY

SECTION ONE — ELECTRICAL ENDURANCE TESTS

1 General requirements

2 Specific requirements

2.1 List of endurance tests

2.2 Conditions for the endurance tests

2.3 Failure criteria for the failure-defining characteristics for acceptance tests

2.4 Failure criteria and failure-defining characteristics for reliability tests

2.5 Procedure in case of a testing error

TABLE